Investigation of adhesion features of bonded interfaces
نویسندگان
چکیده
With the increasing application of flip-chip technology in the microelectronics industry, the adhesion strength of interfaces in the flip-chip microelectronic structures has become an important issue for manufacturing and operation. The existence of defects in the corresponding interfaces can gradually degrade the interfacial adhesion when the package is exposed to the high temperature and humidity. First, the effects of the temperature and relative humidity on the warpage of PBGA package were studied by using shadow Moire method. Then, the effects of IC package with different solder mask thickness under different temperature and humidity environment conditions on the adhesion strength were studied. The control parameters are environmental temperature, environmental humidity, soaking time and solder mask thickness. The interfacial adhesion strength was obtained by using a dynamic material testing system (MTS 810) with a set of special testing jig. By Statistical Package for the Social Science (SPSS) regression analysis, the relative equation of the interfacial adhesion strength to the humidity weight and humidity weight to the other parameters (i.e. temperature, soaking time and solder mask thickness) can be determined.
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